About This Show
IC Packaging Fair. Laminating technology and equipment, Soldering equipment, Test and measurement equipment, Laboratory test and measurement equipment, PCBA section test and measurement equipment, Finished product assembly section test and measurement...
IC Packaging Fair is an annual trade show held in Shenzhen, China, dedicated to the Technology sector. The event is scheduled for Oct 27-29, 2026. IC Packaging Fair serves as a meeting point for manufacturers, suppliers, buyers, and decision-makers across the Technology sector. The exhibition showcases the latest products, technologies, and innovations in Technology, giving attendees direct access to suppliers and thought leaders. Whether you are attending to source new suppliers, launch a product, or keep pace with industry developments, IC Packaging Fair offers valuable opportunities for networking and business growth. The listing also tracks practical planning details for Shenzhen World Exhibition & Convention Center, including the event location, dates, and links to official resources when they are available. IC Packaging Fair is useful for exhibitors building a regional sales calendar, attendees comparing events in similar sectors, and teams deciding where face-to-face meetings can support pipeline, partnerships, and market research. Use this page to compare the show's timing, location, audience scale, exhibitor profile, and TradeShowBuzz scores before shortlisting it for your next event plan.