IC & Sensor Packaging Expo Japan - Osaka

May 12-14, 2027
Home/Trade Shows/IC & Sensor Packaging Expo Japan - Osaka

About This Show

Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services. Assembly Equipment, Packaging Materials / Equipment, Analysis/Simulation Software for IC Packaging...

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Buzz Score
6.2
Content Quality5.5
Networking5.5
Venue & Logistics7.5

Key Details

FrequencyAnnual
CostTBA
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